EN

CN

Search ..

Share on Wechat

Click on the blank space to close

Focus on high-efficiency electric energy conversion to build a low-carbon beautiful life

Focus on high-efficiency electric energy conversion to build a low-carbon beautiful life

成都高投芯未半导体有限公司 / CD Power Semiconductor Co., Ltd

Business Presentation

Automatically expand

click to expand

Wafer Process

Module Wrapping

Integrated Package
Focus on high-efficiency electric energy conversion to build a low-carbon beautiful life

Focus on high-efficiency electric energy conversion to build a low-carbon beautiful life

成都高投芯未半导体有限公司 / CD Power Semiconductor Co., Ltd

Business Presentation

Automatically expand

click to expand

Wafer Process

Module Wrapping

Integrated Package
Focus on high-efficiency electric energy conversion to build a low-carbon beautiful life

Focus on high-efficiency electric energy conversion to build a low-carbon beautiful life

成都高投芯未半导体有限公司 / CD Power Semiconductor Co., Ltd

Business Presentation

Automatically expand

click to expand

Wafer Process

Module Wrapping

Integrated Package

About Us

致力于成为 国际领先的集成功率器件制造服务商

企业简介

成都高投芯未半导体有限公司设立于2022年1月，由成都高新发展股份有限公司出资设立，主要为客户提供从芯片背面加工-模块封测代工-组件的一条龙代工服务。

项目地址

四川省成都市高新西区康强三路1111号

Company Culture

Development Path

Corporate Honor

Wafer Process

采用背面研磨减薄工艺、离子注入、激光退火及金属溅射淀积工艺等业界先进的背面加工工艺

Module Wrapping

采用业界先进的IGBT封装工艺

Integrated Package

整合新能源产业链上下游资源，提供新能源产业的关键器件、设备、系统等全流程产品

Wafer Process
Module Wrapping
Integrated Package

News Center